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Production capacity
Capabilities
Process Item Description Capability UL Capability
Material Cutting Max. Dimension 508*622mm(SS)
470*622mm(DS&ML) 		510*610mm(SS)
558*622mm(DS)
558*610mm(ML) 		No restriction
Inner Layer Min.lin/Space 4.0 mil / 4.0 mil 4.0 mil / 4.0 mil 3.15/3mil
Copper Thickness 1/3 - 3oz 1/3 - 3oz ≤3oz
Registration Tolerance +/- 0.05mm +/- 0.05mm No requirement
Lamination Press Layer Count 1 - 8 Layer 1 - 8 Layer No requirement
Thickness 0.4 - 3.2mm 0.4 - 3.2mm ≥0.38mm
Drilling Min. Hole Diameter 0.2 mm 0.25 No requirement
PTH Diameter Tolerance +/- 0.08mm +/- 0.08mm No requirement
NPTH Diameter Tolerance +/- 0.05mm +/- 0.05mm No requirement
Aspect Ratio 8:1 8:1 No requirement
Outer Layer Min. Line/Space 4.0 mil / 4.0 mi 4.0 mil / 3.15 mil Min trace widths 3.15mil, no requirement for min trace  spacing
Copper Thickness 1/3 - 4oz 1/3 - 4oz ≥Hoz
Registration Tolerance +/- 0.05mm +/- 0.05mm No requirement
Impedance Control NG NG
Process Item Description Uniwell Capability UL Capability
Solder Masking Min.Solder Dam 0.1mm 0.1mm No requirement
Min.Solder Mask Opening 0.07mm 0.07mm No requirement
Registration Tolerance +/- 0.1mm +/- 0.1mm ≤3oz
Solder Mask Plugging ≦0.6mm ≦0.6mm No requirement
Surface Treatment Enig Ni: 2.5-8.0um; Ni: 2.5-8.0um; No requirement
OSP 0.2-0.5um 0.2-0.5um No requirement
Immersion Tin 0.2 - 0.5um 0.8 – 1.0um No requirement
Immersion Silver 0.8 - 1.0um 0.15 – 0.45um No requirement
LF-HASL ≧1.0um ≧2.54um No requirement
Out-Line Profiling Profile Tolerance +/- 0.10mm +/- 0.10mm No requirement
V-cut Angle Tolerance +/- 5° +/- 5° No requirement
V-cut Remain Thickness Tolerance +/- 0.1mm +/- 0.1mm No requirement
Final Product Thickness Tolerrance +/- 10% +/- 10% No requirement
Warpage Tolerrance +/-0.75% +/-0.75% No requirement